BPDA CAS# 2420-87-3

Superior Heat Resistance
This material delivers consistent, reliable performance in high-temperature scenarios, making it ideal for heat-resistant wires, heating elements, and satellite thermal control films.
Exceptional Electrical Performance
It is highly suitable for tape automated bonding (TAB), chip-on-film (COF), flexible printed circuits (FPC), and printed circuit boards, ensuring stable insulation and signal transmission performance.
Robust Mechanical Support
Offering excellent strength and rigidity, it serves as a dependable material for FPC stiffeners, metal substrates, and heavy-duty electrical machinery components.
Broad Application Versatility
With wide-ranging compatibility, it is applied across electronics, solar cells, speaker diaphragms, and office automation equipment, demonstrating extensive industrial applicability.

Applications of 3,3′,4,4′-Biphenyltetracarboxylic Dianhydride
This compound is widely used in tape automated bonding (TAB), chip-on-film (COF), lead lock tapes, and high-density flexible printed circuits (FPC)—including FPC stiffeners. It also finds application in office automation equipment, flexible solar cells, and speaker diaphragms for mobile phones, plasma televisions, and automotive audio systems, as well as in heavy electrical machinery. Other key application areas include satellite thermal control films, printed circuit boards, metal substrates, sheet-type heating elements, and heat-resistant wires.

English Name3,3',4,4'-Biphenyltetracarboxylic dianhydride
English Synonyms3,3',4,4'-Biphenyl tetracarboxylic diandhydride;[1,1'-Biphenyl]-3,3',4,4'-tetracarboxylic3,4:3',4'-dianhydride; 3,4,3',4'-Biphenyltetracarboxylic acid dianhydride;3,3',4,4'-Biphenyltetracarboxylic dianhydride 97%6;4,4'-Bip hthalic Anhydride (purified by sublimation);3,3'4,4'-Biphenyl tetracarboxylic acid dianhydride(s-BPDA);S-BD PA;S-BPDA
CAS Number2420-87-3
Molecular FormulaC16H606
Molecular Weight294.22
EINECS Number219-342-9
Melting point299-305 °C (lit.)
Boiling point614.9±48.0 °C(Predicted)
Density1.625±0.06 g/cm3(Predicted)
Vapor pressureOPa at 20℃
Storage conditionsInert atmosphere,Room Temperature
SolubilityAlmost transparent in hot DMF
FormPowder crystals
ColorOff-white
Maximum wavelength (λmax)300nm(lit.)
InChIInChI=1S/C16H6O6/c17-13-9-3-1-7(5-11(9)15(19)21-13)8-2-4-10-12(6-8)16(20)22-14(10)18/h1-6H
InChIKeyWKDNYTOXBCRNPV-UHFFFAOYSA-N
SmilesC1(=O)C2=C(C=C(C3C=CC4C(=O)OC(=O)C=4C=3)C=C2)C(=0)01
LogP3.91
91d90a419fb30888f98e382c140ca293.webp

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